{"id":371597,"date":"2024-10-20T02:25:28","date_gmt":"2024-10-20T02:25:28","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61189-5-6012021\/"},"modified":"2024-10-26T04:12:45","modified_gmt":"2024-10-26T04:12:45","slug":"bs-en-iec-61189-5-6012021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61189-5-6012021\/","title":{"rendered":"BS EN IEC 61189-5-601:2021"},"content":{"rendered":"

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.<\/p>\n

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PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publications with their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
11<\/td>\nFOREWORD <\/td>\n<\/tr>\n
13<\/td>\n1 Scope
2 Normative references
Tables
Table 1 \u2013 Test items defined in this document <\/td>\n<\/tr>\n
14<\/td>\n3 Terms and definitions <\/td>\n<\/tr>\n
15<\/td>\n4 Grouping of soldering processes and related test severities <\/td>\n<\/tr>\n
16<\/td>\n5 Specimens
5.1 Devices
Table 2 \u2013 Grouping of soldering processes and typical test severities \u2013 Overview <\/td>\n<\/tr>\n
17<\/td>\nFigures
Figure 1 \u2013 Example of a test circuit for the electrical continuity test of a solder joint
Figure 2 \u2013 Example of area array type packages
Figure 3 \u2013 Example of leaded type devices
Figure 4 \u2013 Example of leadless termination type devices <\/td>\n<\/tr>\n
18<\/td>\n5.2 Test substrate
5.3 Solder paste
Figure 5 \u2013 Example of connector for card type devices
Figure 6 \u2013 Example of shielding metal components <\/td>\n<\/tr>\n
19<\/td>\n5.4 Solder ball
6 Apparatus and equipment
6.1 Constant temperature and humidity testing equipment
Figure 7 \u2013 Recommended solder ball shape <\/td>\n<\/tr>\n
20<\/td>\n6.2 Device-mounting equipment
6.3 X-ray transmission equipment
6.4 Electrical resistance recorder
6.5 Warpage measurement equipment
Table 3 \u2013 Stencil design standard for devices <\/td>\n<\/tr>\n
21<\/td>\n6.6 Temperature cycling chamber
6.7 Pull strength test equipment
7 Tg1 Solder joint initial quality after reflow
7.1 General
7.2 Specimen preparation
7.3 Pre-process
7.3.1 Pre-conditioning
7.3.2 Initial measurement
Figure 8 \u2013 Test procedure for Tg1 <\/td>\n<\/tr>\n
22<\/td>\n7.3.3 Moistening process (1)
7.3.4 Baking and warp correction
7.3.5 Pre-reflow heating
7.3.6 Moistening process (2)
7.4 Assembly process
7.4.1 Solder paste printing <\/td>\n<\/tr>\n
23<\/td>\n7.4.2 Device mounting
Figure 9 \u2013 Example of printed conditions of solder paste
Figure 10 \u2013 Typical reflow soldering profile for Sn63Pb37 solder alloy <\/td>\n<\/tr>\n
24<\/td>\nFigure 11 \u2013 Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy <\/td>\n<\/tr>\n
25<\/td>\nFigure 12 \u2013 Reflow temperature profile for soldering ability
Table 4 \u2013 Maximum reflow heating conditions <\/td>\n<\/tr>\n
26<\/td>\n7.4.3 Reflow heating
Figure 13 \u2013 Temperature measurement of the package device using thermocouples
Figure 14 \u2013 Temperature measurement of other specimen using thermocouples
Table 5 \u2013 Minimum reflow heating conditions <\/td>\n<\/tr>\n
27<\/td>\n7.5 Recovery
7.6 Final measurement
8 Tg2 warpage of component and printed boards in reflow process
8.1 General
8.2 Specimen preparation
Figure 15 \u2013 Test procedure for Tg2 <\/td>\n<\/tr>\n
28<\/td>\n8.3 Assembly process
8.3.1 Initial measurement
8.3.2 Baking and warp correction
8.3.3 Pre-reflow heating
8.4 Final measurement
8.4.1 Warpage measurement
8.4.2 Measurement area
8.4.3 Gap measurement <\/td>\n<\/tr>\n
29<\/td>\nFigure 16 \u2013 Contact point <\/td>\n<\/tr>\n
30<\/td>\n9 Tg3 Resistance to soldering heat of printed boards
9.1 General
Figure 17 \u2013 Maximum gap <\/td>\n<\/tr>\n
31<\/td>\n9.2 Specimen preparation
9.3 Pre-process
9.3.1 Pre-conditioning
9.3.2 Initial measurement
9.3.3 Moistening process (1)
9.3.4 Baking and warp correction
9.4 Reflow heating
Figure 18 \u2013 Test procedure for Tg3 <\/td>\n<\/tr>\n
32<\/td>\n9.5 Final measurement
10 Tg4 Wetting and dewetting of a printed-board land
10.1 General
10.2 Specimen preparation
10.3 Pre-process
10.3.1 Pre-conditioning
Figure 19 \u2013 Test procedure for Tg4 <\/td>\n<\/tr>\n
33<\/td>\n10.3.2 Initial measurement
10.3.3 Moistening process (1)
10.3.4 Pre-baking
10.3.5 Pre-reflow heating
10.3.6 Moistening process (2)
10.4 Assembly process
10.4.1 Solder paste printing
10.4.2 Reflow heating <\/td>\n<\/tr>\n
34<\/td>\n10.5 Final measurement
10.5.1 Measurement
Table 6 \u2013 Wetting level <\/td>\n<\/tr>\n
35<\/td>\n10.5.2 Flux removal
11 Tg5 Resistance to dissolution of a printed-board land
11.1 General
Figure 20 \u2013 State of solder wetting
Figure 21 \u2013 Solder contact angle <\/td>\n<\/tr>\n
36<\/td>\n11.2 Specimen preparation
11.3 Pre-process
11.3.1 Pre-conditioning
11.3.2 Initial measurement
11.4 Assembly process
11.4.1 Solder paste printing
11.4.2 Reflow heating
11.5 Final measurement
11.5.1 Observation
Figure 22 \u2013 Test procedure for Tg5 <\/td>\n<\/tr>\n
37<\/td>\n11.5.2 Observation method
11.5.3 Measurement
Figure 23 \u2013 Evaluation of resistance to dissolution of land <\/td>\n<\/tr>\n
38<\/td>\n11.5.4 Example of influence upon occurrence of dissolution
12 Tg6 Pull strength of the test substrate land
12.1 General
Figure 24 \u2013 Cross-section observation <\/td>\n<\/tr>\n
39<\/td>\n12.2 Specimen preparation
12.3 Pre-process
12.3.1 Pre-conditioning
12.3.2 Initial measurement
12.3.3 Pre-baking
12.3.4 Pre-reflow heating
12.4 Assembly process
12.4.1 Solder paste printing
12.4.2 Solder ball placement
Figure 25 \u2013 Test procedure for Tg6 <\/td>\n<\/tr>\n
40<\/td>\n12.4.3 Reflow heating process
12.5 Final measurement
12.5.1 Pull strength measurement
12.5.2 Pull strength measuring method A \u2013 Probe heat bond method
12.5.3 Pull strength measuring method B \u2013 Ball pinch method
Figure 26 \u2013 Measuring methods for pull strength <\/td>\n<\/tr>\n
41<\/td>\n12.5.4 Pull strength measuring method C \u2013 Pin pull down method
12.5.5 Pull strength measuring method D \u2013 Lead pull method
12.5.6 Final observation <\/td>\n<\/tr>\n
42<\/td>\nFigure 27 \u2013 Breaking modes in pull strength test <\/td>\n<\/tr>\n
43<\/td>\nAnnex A (informative)Test process items and meaning of processing contents and condition
A.1 General
A.2 Meaning of processing contents and condition
A.3 Test process items
Table A.1 \u2013 Meaning of processing contents and condition <\/td>\n<\/tr>\n
44<\/td>\nTable A.2 \u2013 Test process items and clauses <\/td>\n<\/tr>\n
45<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n46<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":371606,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-371597","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/371597","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/371606"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=371597"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=371597"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=371597"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}