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ISO 9453:2020
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Soft solder alloys — Chemical compositions and forms
Published By | Publication Date | Number of Pages |
ISO | 2020-09 | 20 |
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.