{"id":423559,"date":"2024-10-20T06:47:08","date_gmt":"2024-10-20T06:47:08","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-cen-clc-tr-17603-31-102021-2\/"},"modified":"2024-10-26T12:44:08","modified_gmt":"2024-10-26T12:44:08","slug":"bsi-pd-cen-clc-tr-17603-31-102021-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-cen-clc-tr-17603-31-102021-2\/","title":{"rendered":"BSI PD CEN\/CLC\/TR 17603-31-10:2021"},"content":{"rendered":"
Solid-liquid phase-change materials (PCM) are a favoured approach to spacecraft passive thermal control for incident orbital heat fluxes or when there are wide fluctuations in onboard equipment.<\/p>\n
The PCM thermal control system consists of a container which is filled with a substance capable of undergoing a phase-change. When there is an the increase in surface temperature of spacecraft the PCM absorbs the excess heat by melting. If there is a temperature decrease, then the PCM can provide heat by solidifying.<\/p>\n
Many types of PCM systems are used in spacecrafts for different types of thermal transfer control.<\/p>\n
Characteristics and performance of phase control materials are described in this Part. Existing PCM systems are also described.<\/p>\n
The Thermal design handbook is published in 16 Parts<\/p>\n
TR 17603-31-01 Thermal design handbook \u2013 Part 1: View factors<\/p>\n
TR 17603-31-02 Thermal design handbook \u2013 Part 2: Holes, Grooves and Cavities<\/p>\n
TR 17603-31-03 Thermal design handbook \u2013 Part 3: Spacecraft Surface Temperature<\/p>\n
TR 17603-31-04 Thermal design handbook \u2013 Part 4: Conductive Heat Transfer<\/p>\n
TR 17603-31-05 Thermal design handbook \u2013 Part 5: Structural Materials: Metallic and Composite<\/p>\n
TR 17603-31-06 Thermal design handbook \u2013 Part 6: Thermal Control Surfaces<\/p>\n
TR 17603-31-07 Thermal design handbook \u2013 Part 7: Insulations<\/p>\n
TR 17603-31-08 Thermal design handbook \u2013 Part 8: Heat Pipes<\/p>\n
TR 17603-31-09 Thermal design handbook \u2013 Part 9: Radiators<\/p>\n
TR 17603-31-10 Thermal design handbook \u2013 Part 10: Phase \u2013 Change Capacitors<\/p>\n
TR 17603-31-11 Thermal design handbook \u2013 Part 11: Electrical Heating<\/p>\n
TR 17603-31-12 Thermal design handbook \u2013 Part 12: Louvers<\/p>\n
TR 17603-31-13 Thermal design handbook \u2013 Part 13: Fluid Loops<\/p>\n
TR 17603-31-14 Thermal design handbook \u2013 Part 14: Cryogenic Cooling<\/p>\n
TR 17603-31-15 Thermal design handbook \u2013 Part 15: Existing Satellites<\/p>\n
TR 17603-31-16 Thermal design handbook \u2013 Part 16: Thermal Protection System<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1 Scope <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 2 References <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 3 Terms, definitions and symbols 3.1 Terms and definitions 3.2 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 3.3 Symbols <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 4 Introduction <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5 PC working materials 5.1 General 5.1.1 Supercooling <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.1.1.1 Experimental investigations 5.1.1.2 Results <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5.1.2 Nucleation <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 5.1.3 The effect of gravity on melting and freezing of the pcm <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 5.1.4 Bubble formation 5.2 Possible candidates <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | 5.3 Selected candidates <\/td>\n<\/tr>\n | ||||||
54<\/td>\n | 6 PCM technology 6.1 Containers 6.2 Fillers <\/td>\n<\/tr>\n | ||||||
55<\/td>\n | 6.3 Containers and fillers 6.3.1 Materials and corrosion <\/td>\n<\/tr>\n | ||||||
58<\/td>\n | 6.3.2 Exixting containers and fillers 6.3.2.1 Container and fillers developed by dornier system <\/td>\n<\/tr>\n | ||||||
62<\/td>\n | 7 PCM performances 7.1 Analytical predictions 7.1.1 Introduction <\/td>\n<\/tr>\n | ||||||
63<\/td>\n | 7.1.2 Heat transfer relations <\/td>\n<\/tr>\n | ||||||
69<\/td>\n | 8 Existing systems 8.1 Introduction <\/td>\n<\/tr>\n | ||||||
70<\/td>\n | 8.2 Dornier system <\/td>\n<\/tr>\n | ||||||
83<\/td>\n | 8.3 Ike <\/td>\n<\/tr>\n | ||||||
103<\/td>\n | 8.4 B&k engineering <\/td>\n<\/tr>\n | ||||||
108<\/td>\n | 8.5 Aerojet electrosystems <\/td>\n<\/tr>\n | ||||||
118<\/td>\n | 8.6 Trans temp <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Space engineering. Thermal design handbook – Phase. Change Capacitor<\/b><\/p>\n |