{"id":421285,"date":"2024-10-20T06:35:21","date_gmt":"2024-10-20T06:35:21","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-32017-2\/"},"modified":"2024-10-26T12:20:15","modified_gmt":"2024-10-26T12:20:15","slug":"bs-en-60749-32017-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-32017-2\/","title":{"rendered":"BS EN 60749-3:2017"},"content":{"rendered":"
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Test apparatus 5 Procedure <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 6 Failure criteria 7 Summary <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Annex A (informative) External visual report form\/checklist (example only \u2013 not a mandatory template) A.1 Leads <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | A.2 Lead finish A.3 Moulding and mould compound <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | A.4 Critical sealant A.5 Attachments A.6 Marking <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | A.7 Solder Balls A.8 Substrate A.9 Exposed (Backside) Silicon <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Mechanical and climatic test methods – External visual examination<\/b><\/p>\n |