This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication.<\/p>\n
The aim of this standard is<\/p>\n
to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability;<\/p>\n<\/li>\n
to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.<\/p>\n<\/li>\n<\/ul>\n
In addition, guidance is given in IEC TR 62572-2.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 3 Terms, definitions, symbols and abbreviations 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 3.2 Symbols and abbreviations 4 Laser reliability and quality assurance procedure 4.1 Demonstration of product quality <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 4.2 Testing responsibilities 4.2.1 General 4.2.2 Recommendation applicable to laser customer\/system supplier 4.2.3 Recommendation applicable to system operator 4.3 Quality improvement programmes (QIPs) 5 Tests 5.1 General <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 5.2 Structural similarity 5.3 Burn-in and screening (when applicable in the specification) Tables Table 1 \u2013 Initial qualification (1 of 3) <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Table 2 \u2013 Maintenance of qualification (1 of 2) <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 6 Activities 6.1 Analysis of reliability results 6.2 Technical visits to LMMs Table 3 \u2013 Performance for laser module reliability parameters <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 6.3 Design\/process changes 6.4 Deliveries 6.5 Supplier documentation <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Annex A (informative) Guidance on testing in Table 1 and Table 2 A.1 Laser module life tests containing thermoelectric coolers (Table 1, test 1.1) A.2 Laser module life tests for uncooled modules (Table 1, test 1.2) Table A.1 \u2013 Recommended life test conditions for laser modulescontaining Peltier coolers <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | A.3 Laser diode life tests on submounts (Table 1, test 1.3) A.4 Monitor photodiode life tests (Table 1, test 1.4) Table A.2 \u2013 Recommended life test conditions for uncooled laser modules Table A.3 \u2013 Recommended laser diode life test conditions <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | A.5 Temperature cycling and thermal shock (Table 1, test 3 and Table 2, test 2) A.6 Sealing\/hermeticity (Table 1, test 4 and Table 2, test 3) A.7 Shock and vibration (Table 1 , test 5 and Table 2, test 4) A.8 High-temperature storage (Table 1, test 6 and Table 2, test 5) Table\u00a0A.4 \u2013 Recommended photodiode life test conditions <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | A.9 Electrostatic discharge sensitivity (ESD) (Table 1, test 7and Table 2, test 6) A.10 Residual gas analysis (RGA) (Table 1, test 8 and, Table 2, test 7) <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fibre optic active components and devices. Reliability standards – Laser modules used for telecommunication<\/b><\/p>\n |