This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process.<\/p>\n
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4 Classification 4.1 General 4.2 Alloy composition <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.3 Solder form 4.4 Flux type Tables Table 1 \u2013 Solder materials <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.5 Flux percentage and metal content Table 2 \u2013 Flux types and designating symbols <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 4.6 Other characteristics 5 Requirements 5.1 Materials 5.2 Alloys 5.2.1 General 5.2.2 Variation D alloys Table 3 \u2013 Flux percentage <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.3 Solder forms 5.3.1 General 5.3.2 Bar solder 5.3.3 Wire solder 5.3.4 Ribbon solder 5.3.5 Solder powder <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 5.3.6 Special solder 5.4 Flux type and form 5.4.1 General 5.4.2 Flux percentage Table 4 \u2013 Standard solder powders <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.4.3 Solder cores 5.4.4 Solder coatings 5.5 Flux residue dryness 5.6 Spitting 5.7 Solder pool 5.8 Labelling for product identification <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.9 Workmanship 6 Quality assurance provisions 6.1 Responsibility for inspection and compliance 6.1.1 General 6.1.2 Quality assurance programme 6.1.3 Test equipment and inspection facilities 6.1.4 Inspection conditions 6.2 Classification of inspections <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Figures Figure 1 \u2013 Report form for solder alloy tests <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Figure 2 \u2013 Report form for solder powder tests <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | Figure 3 \u2013 Report form for non-fluxed solder tests <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Figure 4 \u2013 Report form for fluxed wire\/ribbon solder tests <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 6.3 Inspection of materials 6.4 Qualification inspections 6.4.1 General 6.4.2 Sample size 6.4.3 Inspection routine Table 5 \u2013 Solder inspections <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 6.5 Quality conformance 6.5.1 General 6.5.2 Inspection routine 6.5.3 Sampling plan 6.5.4 Rejected lots 6.6 Preparation of solder alloy for test 6.6.1 General 6.6.2 Wire solder up to approximately 6 mm diameter 6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter 7 Preparation for delivery \u2013 Preservation, packing and packaging <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Annex A (informative)Selection of various alloys and fluxes for use in electronic soldering \u2013General information concerning IEC 61190-1-3 A.1 Overview A.2 Intended use A.2.1 General A.2.2 Alloys <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | A.3 Acquisition requirements <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | A.4 Standard solder product packages A.4.1 General A.4.2 Wire and ribbon solders A.4.3 Bar solders A.4.4 Solder powder <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | A.5 Protocol for establishing short names for IEC 61190-1-3 alloys A.5.1 Lead containing solder alloys and specialty alloy A.5.2 Lead-free solder alloys <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | A.6 Standard description of solid solder products <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Annex B (normative)Lead-free solder alloys Table B.1 \u2013 The composition and temperature characteristicsof lead-free solder alloys <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | Table B.2 \u2013 The composition and temperature characteristicsof common tin-lead alloys <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Table B.3 \u2013 The composition and temperature characteristics for specialty (non-tin\/lead) alloys <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | Table B.4 \u2013 the cross-reference from solidus and liquidus temperaturesto alloy names by temperature <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Table B.5 \u2013 The cross-reference from ISO 9453 alloy numbers and designationsto IEC 61190-1-3 alloy names <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | Annex C (informative)Marking method of solder designation for mounted board,used in electronic equipment C.1 General C.2 Marking C.2.1 Recommendation for marking C.2.2 Marking for solder designation <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | C.2.3 Marking unit and location Figure C.1 \u2013 Example of the marking for assembled board <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications<\/b><\/p>\n |