{"id":371947,"date":"2024-10-20T02:27:02","date_gmt":"2024-10-20T02:27:02","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61189-5-5012021\/"},"modified":"2024-10-26T04:15:57","modified_gmt":"2024-10-26T04:15:57","slug":"bs-en-iec-61189-5-5012021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61189-5-5012021\/","title":{"rendered":"BS EN IEC 61189-5-501:2021"},"content":{"rendered":"
IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1 Scope 2 Normative references Figures Figure 1 \u2013 SIR pattern <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 3 Terms and definitions 4 Equipment\/Apparatus 4.1 Measurement instrument <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 4.2 Resistor verification coupon 4.3 Damp heat chamber Figure 2 \u2013 Example of a resistor verification coupon <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.4 Additional apparatus 4.4.1 Ionic contamination test system 4.4.2 Drying oven 4.4.3 Camera 4.4.4 Backlight panel 5 Test coupons 5.1 General 5.2 IEC TB144 (IPC B53) test coupon <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.3 Laminate 5.4 Coupons for testing 5.5 Chamber controls Figure 3 \u2013 IPC B53 Surface insulation resistance pattern <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 5.6 Blank process controls 5.7 Test conditions 5.7.1 Fluxes not intended for cleaning 5.7.2 Fluxes intended for cleaning 5.8 Test duration 5.9 Test voltage 5.10 Connecting the test coupons 5.10.1 General 5.10.2 Connector\/test rack <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5.10.3 Direct wiring 5.11 Cable connection 5.12 Coupon orientation in the chamber Figure 4 \u2013 Connector arrangement Figure 5 \u2013 Specimen orientation in test chamber <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 6 Coupon preparation 6.1 General 6.2 Coupon cleaning 6.3 Identification 6.4 Inspection 6.5 Storage Figure 6 \u2013 Coupon orientation in test chamber <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 6.6 No clean fluxes 6.7 Cleanable type fluxes 6.8 Solder paste coupons 6.8.1 Coupon preparation Table 1 \u2013 Coupons for surface insulation resistance (SIR) testing <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 6.8.2 Cleaning of coupons 6.9 Preparation of coupons for chamber 7 Test procedure 8 Measurements 9 Evaluation <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 10 Reporting <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Annex A (informative)General advice for testing A.1 Test coupons A.2 Test coupon development A.3 Sampling A.3.1 General A.3.2 Coupon count A.3.3 Sample sizes A.3.4 Characterising materials A.3.5 Characterising process(es) A.3.6 Derived unit of SIR <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | A.3.7 Set-up parameters A.4 Humidity A.5 Voltage <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes<\/b><\/p>\n |