{"id":360098,"date":"2024-10-20T01:29:15","date_gmt":"2024-10-20T01:29:15","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-503102016-tc\/"},"modified":"2024-10-26T02:14:23","modified_gmt":"2024-10-26T02:14:23","slug":"bs-en-503102016-tc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-503102016-tc\/","title":{"rendered":"BS EN 50310:2016 – TC"},"content":{"rendered":"

To revise EN 50310:2010 in the light of the recent developments at ISO\/IEC JTC 1 level. (EN 50310 was offered to JTC 1 and triggered the first internationally harmonized ISO\/IEC deliverable).<\/p>\n

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PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
89<\/td>\nEuropean foreword <\/td>\n<\/tr>\n
91<\/td>\nIntroduction <\/td>\n<\/tr>\n
92<\/td>\nFigure 1 \u2013 Schematic relationship between EN 50310 and other relevant standards <\/td>\n<\/tr>\n
93<\/td>\nTable 1 \u2013 Contextual relationship between EN 50310 and other relevant standards <\/td>\n<\/tr>\n
94<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
95<\/td>\n3 Terms, definitions and abbreviations
3.1 Terms and definitions <\/td>\n<\/tr>\n
97<\/td>\n3.2 Abbreviations <\/td>\n<\/tr>\n
98<\/td>\n4 Conformance
5 Overview of bonding networks <\/td>\n<\/tr>\n
99<\/td>\nFigure 2 \u2013 Schematic of telecommunications equipment distribution and associated bonding connections <\/td>\n<\/tr>\n
100<\/td>\n6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment
Table 2 \u2013 Sensitivity of cabling media to bonding network performance <\/td>\n<\/tr>\n
101<\/td>\nTable 3 \u2013 Telecommunications bonding network requirements
6.2 Telecommunications bonding networks <\/td>\n<\/tr>\n
102<\/td>\n6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements <\/td>\n<\/tr>\n
103<\/td>\n6.3.2.2 Protective bonding networks
Table 4 \u2013 DC resistance requirements for protective bonding networks
6.3.2.3 Dedicated bonding networks
Table 5 \u2013 DC resistance requirements for dedicated telecommunications bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General <\/td>\n<\/tr>\n
104<\/td>\n6.3.3.2 Dedicated bonding networks
7 Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF) <\/td>\n<\/tr>\n
105<\/td>\n7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections <\/td>\n<\/tr>\n
106<\/td>\n7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements <\/td>\n<\/tr>\n
107<\/td>\nFigure 3 \u2013 Example of three methods of equipment and rack bonding
7.5.1.2 Recommendations
7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations <\/td>\n<\/tr>\n
108<\/td>\n7.5.3 Internal connections
7.5.3.1 Requirements
Figure 4 \u2013 Example of a bond connection from a cabinet to the cabinet door
7.5.3.2 Structural bonding within cabinets, frames and racks <\/td>\n<\/tr>\n
109<\/td>\n7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
Figure 5 \u2013 Example of bonding straps <\/td>\n<\/tr>\n
110<\/td>\n7.7 Documentation
8 Dedicated telecommunications bonding network
8.1 General <\/td>\n<\/tr>\n
111<\/td>\nFigure 6 \u2013 Illustrative example of a large building
Figure 7 \u2013 Illustrative example of a smaller building
8.2 Components
8.2.1 Primary bonding busbar (PBB) <\/td>\n<\/tr>\n
112<\/td>\nFigure 8 \u2013 Schematic of PBB
8.2.2 Secondary bonding busbar (SBB)
Figure 9 \u2013 Schematic of SBB
8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC) <\/td>\n<\/tr>\n
113<\/td>\n8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations <\/td>\n<\/tr>\n
114<\/td>\nTable 6 \u2013 TBB conductor sizing
8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements <\/td>\n<\/tr>\n
115<\/td>\n8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General
8.3.1.2 Bonding to the PBB <\/td>\n<\/tr>\n
116<\/td>\n8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar <\/td>\n<\/tr>\n
117<\/td>\n8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB)
8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal <\/td>\n<\/tr>\n
118<\/td>\n9 Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks
Figure 10 \u2013 Star protective bonding and supplementary telecommunications bonding
Figure 11 \u2013 Example of high common impedance and large loop <\/td>\n<\/tr>\n
119<\/td>\nFigure 12 \u2013 Example of low common impedance and small loop
9.1.2 Ring protective bonding networks
Figure 13 \u2013 Ring protective bonding and supplementary telecommunications bonding <\/td>\n<\/tr>\n
120<\/td>\n9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
Figure 14 \u2013 MESH-BN example <\/td>\n<\/tr>\n
121<\/td>\n9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations
9.3 Bonding for areas of telecommunications equipment concentration
10 Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks <\/td>\n<\/tr>\n
122<\/td>\n10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control
10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
Figure 15 \u2013 Example TEBC to rack bonding conductor connection <\/td>\n<\/tr>\n
123<\/td>\n11 Mesh bonded networks
11.1 General
11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General <\/td>\n<\/tr>\n
124<\/td>\nFigure 16 \u2013 Local mesh bonding network
Figure 17 \u2013 A MESH-IBN having a single point of connection (SPC)
11.2.1.2 Requirements <\/td>\n<\/tr>\n
125<\/td>\n11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
Figure 18 \u2013 A MESH-BN with equipment cabinets, frames, racks and CBN bonded together
11.2.2.2 Requirements <\/td>\n<\/tr>\n
126<\/td>\n11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network <\/td>\n<\/tr>\n
127<\/td>\n11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General <\/td>\n<\/tr>\n
128<\/td>\n11.6.2 Access floors
11.6.2.1 Requirements
Figure 19 \u2013 Example of access floor
11.6.2.2 Recommendations <\/td>\n<\/tr>\n
129<\/td>\n11.6.3 Transient suppression plate (TSP)
Figure 20 \u2013 Example of installation details for an under floor transient suppression plate <\/td>\n<\/tr>\n
130<\/td>\nAnnex A (normative) Maintenance of telecommunications bonding network performance
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results <\/td>\n<\/tr>\n
131<\/td>\nA.3 Causes of performance deterioration
A.3.1 Galvanic corrosion
A.3.2 Requirements <\/td>\n<\/tr>\n
132<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Tracked Changes. Telecommunications bonding networks for buildings and other structures<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2020<\/td>\n0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":360103,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[511,2641],"product_tag":[],"class_list":{"0":"post-360098","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-29-120-50","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/360098","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/360103"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=360098"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=360098"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=360098"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}