{"id":233420,"date":"2024-10-19T15:12:49","date_gmt":"2024-10-19T15:12:49","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-262014\/"},"modified":"2024-10-25T09:42:44","modified_gmt":"2024-10-25T09:42:44","slug":"bs-en-60749-262014","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-262014\/","title":{"rendered":"BS EN 60749-26:2014"},"content":{"rendered":"
This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).<\/p>\n
The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels.<\/p>\n
ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4 Apparatus and required equipment 4.1 Waveform verification equipment <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.2 Oscilloscope 4.3 Additional requirements for digital oscilloscopes 4.4 Current transducer (inductive current probe) 4.5 Evaluation loads 4.6 Human body model simulator <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 4.7 HBM test equipment parasitic properties 5 Stress test equipment qualification and routine verification 5.1 Overview of required HBM tester evaluations 5.2 Measurement procedures 5.2.1 Reference pin pair determination Figures Figure 1 \u2013 Simplified HBM simulator circuit with loads <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 5.2.2 Waveform capture with current probe 5.2.3 Determination of waveform parameters <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 2 \u2013 Current waveform through shorting wires <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 3 \u2013 Current waveform through a 500 \u2126 resistor <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 5.2.4 High voltage discharge path test 5.3 HBM tester qualification 5.3.1 HBM ESD tester qualification requirements 5.3.2 HBM tester qualification procedure Figure 4 \u2013 Peak current short circuit ringing waveform <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 5.4 Test fixture board qualification for socketed testers <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5.5 Routine waveform check requirements 5.5.1 Standard routine waveform check description 5.5.2 Waveform check frequency Tables Table 1 \u2013 Waveform specification <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5.5.3 Alternate routine waveform capture procedure 5.6 High voltage discharge path check 5.6.1 Relay testers 5.6.2 Non-relay testers 5.7 Tester waveform records 5.7.1 Tester and test fixture board qualification records 5.7.2 Periodic waveform check records <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5.8 Safety 5.8.1 Initial set-up 5.8.2 Training 5.8.3 Personnel safety 6 Classification procedure 6.1 Devices for classification 6.2 Parametric and functional testing 6.3 Device stressing <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 6.4 Pin categorization 6.4.1 General 6.4.2 No connect pins 6.4.3 Supply pins <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 6.4.4 Non\u2013supply pins 6.5 Pin groupings 6.5.1 Supply pin groups <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 6.5.2 Shorted non-supply pin groups 6.6 Pin stress combinations 6.6.1 Pin stress combination categorisation <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Table 2 \u2013 Preferred pin combinations sets <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 6.6.2 Non-supply and supply to supply combinations (1, 2, \u2026 N) Table 3 \u2013 Alternative pin combinations sets <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 6.6.3 Non-supply to non-supply combinations <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 6.7 Testing after stressing 7 Failure criteria 8 Component classification Table\u00a04 \u2013 HBM ESD component classification levels <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Annex\u00a0A (informative)HBM test method flow chart <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | Annex\u00a0B (informative)HBM test equipment parasitic properties Figure B.1 \u2013 Diagram of trailing pulse measurement setup <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | Figure B.2 \u2013 Positive stress at 4 000 V Figure B.3 \u2013 Negative stress at 4 000\u00a0V <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | Figure B.4 \u2013 Illustration of measuring voltage before HBM pulsewith a Zener diode or a device Figure B.5 \u2013 Example of voltage rise before the HBM current pulse across a 9,4\u00a0V Zener diode <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | Annex\u00a0C (informative)Example of testing a product using Table\u00a02, Table\u00a03,or Table\u00a02 with a two-pin HBM tester <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | Figure C.1 \u2013 Example to demonstrate the idea of the partitioned test <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | Table C.1 \u2013 Product testing in accordance with Table 2 <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | Table C.2 \u2013 Product testing in accordance with Table\u00a03 <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | Table C.3 \u2013 Alternative product testing in accordance with Table 2 <\/td>\n<\/tr>\n | ||||||
42<\/td>\n | Annex\u00a0D (informative)Examples of coupled non-supply pin pairs <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Mechanical and climatic test methods – Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)<\/b><\/p>\n |