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JIS Z 3284-1:2014

JIS Z 3284-1:2014

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Solder paste – Part 1: Kinds and quality classification

Published By Publication Date Number of Pages
JIS 2014-06-20 16
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This Standard specifies the kinds and quality classification of solder paste to be used in the wiring connection of electrical equipment, electronic equipment, communication equipment or the like, and in manufacturing the parts thereof.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 61190-1-2 : 2007 Attachment materials for electronic assemblyPart 1-2 : Requirements for soldering pastes for high-quality interconnects in electronics assembly (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

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JIS Z 3284-1:2014
$19.50