IPC SM-784:1990
$38.35
Guidelines for Chip-on- Board Technology Implementation
| Published By | Publication Date | Number of Pages |
| IPC | 1990-11-01 | 53 |
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.
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