IPC MC-790:1992

$47.45

Guidelines for Multichip Module Technology Utilization

Published By	Publication Date	Number of Pages
IPC	1992-07	139

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Description

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

Additional information

Published Code	IPC
Published By	IPC International Inc, formerly Institute for Printed Circuits
Publication Date	1992-07
Pages Count	139
Language	English
File Size	2.9 MB