IEC 61191-3:1998
$33.15
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
| Published By | Publication Date | Number of Pages |
| IEC | 1998-08-28 | 40 |
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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