DIN EN IEC 61760-3:2019 Edition

$37.05

Surface mounting technology – Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (Draft)

Published By	Publication Date	Number of Pages
DIN	2019-12	65

Guaranteed Safe Checkout

Categories: 31.020 - Electronic components in general, DIN

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2019-12
Pages Count	65
Language	Germany
Descriptors	Capillary brazing joints, Components, Coordination, Definitions, Electrical engineering, Electronic engineering, Electronic equipment and components, Erecting (construction operation), Guide books, Inspection, Marking, Quality assurance, Reflow soldering, SMD, Soldered joints, Soldering equipment, Soldering points, Solderings, Suitability, Surface mounting, Surface mounting devices, Testing, Testing conditions, Trough-hole mounting
File Size	2.5 MB
ICS Codes	31.020 - Electronic components in general

Preview PDF

DIN EN IEC 61760-3

$37.05


PDF Format	Searchable	Printable	Preview Now

DIN EN IEC 61760-3:2019 Edition

Related products