BS EN IEC 61189-2-803:2023

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for Z-axis expansion of base materials and printed boards

Published By	Publication Date	Number of Pages
BSI	2023	14

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Description

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

PDF Catalog

PDF Pages	PDF Title
2	undefined
5	Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7	English CONTENTS
8	FOREWORD
10	1 Scope 2 Normative references 3 Terms and definitions 4 Preparation of test specimens 5 Test specimens
11	6 Test apparatus 7 Test procedure 8 Calculation Figure 1 – Example TMA data output
12	9 Report
13	Bibliography

Additional information

Status	Definitive
Pages	14
Publication Date	2023-09-13
ISBN	978 0 539 01306 1
Standard Number	BS EN IEC 61189-2-803:2023
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for Z-axis expansion of base materials and printed boards
Identical National Standard Of	EN 61189-2-803 Ed.1.0, IEC 61189-2-803 Ed.1.0
Descriptors	Electronic equipment and components, Laminates, Structures, Printing board, Test methods
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN IEC 61189-2-803:2023

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