BS EN 61439-1:2011
$215.11
Low-voltage switchgear and controlgear assemblies – General rules
Published By | Publication Date | Number of Pages |
BSI | 2011 | 148 |
IEC 61439-1:2011 lays down the definitions and states the service conditions, construction requirements, technical characteristics and verification requirements for low-voltage switchgear and controlgear assemblies. This standard cannot be used alone to specify an ASSEMBLY or used for a purpose of determining conformity. ASSEMBLIES shall comply with the relevant part of the IEC 61439 series; Parts 2 onwards. This standard applies to low-voltage switchgear and controlgear assemblies (ASSEMBLIES) only when required by the relevant ASSEMBLY standard as follows: – ASSEMBLIES for which the rated voltage does not exceed 1 000 V in case of a.c. or 1 500 V in case of d.c.; – stationary or movable ASSEMBLIES with or without enclosure; – ASSEMBLIES intended for use in connection with the generation, transmission, distribution and conversion of electric energy, and for the control of electric energy consuming equipment; – ASSEMBLIES designed for use under special service conditions, for example in ships and in rail vehicles provided that the other relevant specific requirements are complied with; – ASSEMBLIES designed for electrical equipment of machines provided that the other relevant specific requirements are complied with. This second edition cancels and replaces the first edition published in 2009. It constitutes a technical revision. This second edition includes the following significant technical changes with respect to the last edition of IEC 61439-1: – revision of service conditions in Clause 7; – numerous changes regarding verification methods in Clause 10; – modification of routine verification in respect of clearances and creepage distances (see 11.3); – adaption of the tables in Annex C and Annex D to the revised requirements and verification methods; – revision of the EMC requirements in Annex J; – shifting of tables from Annex H to new Annex N; – new Annex O with guidance on temperature rise verification; – new Annex P with a verification method for short-circuit withstand strength (integration of the content of IEC/TR 61117); – update of normative references; – general editorial review.
PDF Catalog
PDF Pages | PDF Title |
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11 | English CONTENTS |
17 | INTRODUCTION |
18 | 1 Scope 2 Normative references |
21 | 3 Terms and definitions 3.1 General terms |
23 | 3.2 Constructional units of assemblies |
24 | 3.3 External design of assemblies 3.4 Structural parts of assemblies |
26 | 3.5 Conditions of installation of assemblies 3.6 Insulation characteristics |
29 | 3.7 Protection against electric shock |
31 | 3.8 Characteristics |
33 | 3.9 Verification |
34 | 3.10 Manufacturer/user 4 Symbols and abbreviations |
35 | 5 Interface characteristics 5.1 General 5.2 Voltage ratings |
36 | 5.3 Current ratings |
37 | 5.4 Rated diversity factor (RDF) 5.5 Rated frequency (fn) 5.6 Other characteristics |
38 | 6 Information 6.1 assembly designation marking 6.2 Documentation |
39 | 6.3 Device and/or component identification 7 Service conditions 7.1 Normal service conditions |
40 | 7.2 Special service conditions |
41 | 7.3 Conditions during transport, storage and installation 8 Constructional requirements 8.1 Strength of materials and parts |
42 | 8.2 Degree of protection provided by an assembly enclosure |
43 | 8.3 Clearances and creepage distances |
45 | 8.4 Protection against electric shock |
51 | 8.5 Incorporation of switching devices and components |
53 | 8.6 Internal electrical circuits and connections |
55 | 8.7 Cooling 8.8 Terminals for external conductors |
57 | 9 Performance requirements 9.1 Dielectric properties |
58 | 9.2 Temperature rise limits 9.3 Short-circuit protection and short-circuit withstand strength |
59 | 9.4 Electromagnetic compatibility (EMC) |
60 | 10 Design verification 10.1 General |
61 | 10.2 Strength of materials and parts |
65 | 10.3 Degree of protection of assemblies 10.4 Clearances and creepage distances |
66 | 10.5 Protection against electric shock and integrity of protective circuits |
67 | 10.6 Incorporation of switching devices and components 10.7 Internal electrical circuits and connections 10.8 Terminals for external conductors 10.9 Dielectric properties |
70 | 10.10 Verification of temperature rise |
80 | 10.11 Short-circuit withstand strength |
86 | 10.12 Electromagnetic compatibility (EMC) 10.13 Mechanical operation 11 Routine verification 11.1 General |
87 | 11.2 Degree of protection of enclosures 11.3 Clearances and creepage distances 11.4 Protection against electric shock and integrity of protective circuits 11.5 Incorporation of built-in components 11.6 Internal electrical circuits and connections 11.7 Terminals for external conductors |
88 | 11.8 Mechanical operation 11.9 Dielectric properties 11.10 Wiring, operational performance and function Tables Table 1 – Minimum clearances in air a (8.3.2) |
89 | Table 2 – Minimum creepage distances (8.3.3) Table 3 – Cross-sectional area of a copper protective conductor (8.4.3.2.2) |
90 | Table 4 – Conductor selection and installation requirements (8.6.4) Table 5 – Minimum terminal capacity for copper protective conductors (PE, PEN) (8.8) |
91 | Table 6 – Temperature-rise limits (9.2) |
92 | Table 7 – Values for the factor n a (9.3.3) Table 8 – Power-frequency withstand voltage for main circuits (10.9.2) Table 9 – Power-frequency withstand voltage for auxiliary and control circuits (10.9.2) |
93 | Table 10 – Impulse withstand test voltages (10.9.3) Table 11 – Copper test conductors for rated currents up to 400 A inclusive (10.10.2.3.2) |
94 | Table 12 – Copper test conductors for rated currents from 400 A to 4 000 A (10.10.2.3.2) Table 13 – Short-circuit verification by comparison with a reference design:check list (10.5.3.3, 10.11.3 and 10.11.4) |
95 | Table 14 – Relationship between prospective fault current and diameter of copper wire |
96 | Annex A (normative) Minimum and maximum cross-section of copper conductors suitable for connection to terminals for external conductors (see 8.8) Table A.1 – Cross-section of copper conductors suitable for connection to terminals for external conductors |
97 | Annex B (normative) Method of calculating the cross-sectional area of protective conductors with regard to thermal stresses due to currents of short duration Table B.1 – Values of k for insulated protective conductors not incorporated in cables, or bare protective conductors in contact with cable covering |
98 | Annex C (informative) User information template Table C.1 – Template |
102 | Annex D (informative) Design verification Table D.1 – List of design verifications to be performed |
103 | Annex E (informative) Rated diversity factor |
104 | Figures Figure E.1 – Typical assembly |
105 | Table E.1 – Examples of loading for an assembly with a rated diversity factor of 0,8 |
106 | Figure E.2 – Example 1: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,8 |
107 | Figure E.3 – Example 2: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,8 |
108 | Figure E.4 – Example 3: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,8 |
109 | Figure E.5 – Example 4: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,8 |
110 | Figure E.6 – Example of average heating effect calculation Table E.2 – Example of loading of a group of circuits (Section B – Figure E.1) with a rated diversity factor of 0,9 Table E.3 – Example of loading of a group of circuits (Sub-distribution board – Figure E.1) with a rated diversity factor of 0,9 |
111 | Figure E.7 – Example graph for the relation between the equivalent RDF and the parameters at intermittent duty at t1 = 0,5 s, I1 = 7*I2 at different cycle times Figure E.8 – Example graph for the relation between the equivalent RDF and the parameters at intermittent duty at I1 = I2 (no starting overcurrent) |
112 | Annex F (normative) Measurement of clearances and creepage distances Table F.1 – Minimum width of grooves |
116 | Figure F.1 – Measurement of ribs |
117 | Annex G (normative) Correlation between the nominal voltage of the supply system and the rated impulse withstand voltage of the equipment |
118 | Table G.1 – Correspondence between the nominal voltage of the supply system and the equipment rated impulse withstand voltage |
119 | Annex H (informative) Operating current and power loss of copper conductors Table H.1 – Operating current and power loss of single-core copper cables with a permissible conductor temperature of 70 °C (ambient temperature inside the assembly: 55 °C) |
120 | Table H.2 – Reduction factor k1 for cables with a permissible conductor temperature of 70 °C (extract from IEC 60364-5-52:2009, Table B.52.14) |
121 | Annex I (Void) |
122 | Annex J (normative) Electromagnetic compatibility (EMC) Figure J.1 – Examples of ports |
126 | Table J.1 – Tests for EMC immunity for environment A(see J.10.12.1) |
127 | Table J.2 – Tests for EMC immunity for environment B(see J.10.12.1) |
128 | Table J.3 – Acceptance criteria when electromagnetic disturbances are present |
129 | Annex K (normative) Protection by electrical separation |
131 | Table K.1 – Maximum disconnecting times for TN systems |
132 | Annex L (informative) Clearances and creepage distances for North American region Table L.1 – Minimum clearances in air Table L.2 – Minimum creepage distances |
133 | Annex M (informative) North American temperature rise limits Table M.1 – North American temperature rise limits |
134 | Annex N (normative) Operating current and power loss of bare copper bars Table N.1 – Operating current and power loss of bare copper bars with rectangular cross-section, run horizontally and arranged with their largest face vertical, frequency 50 Hz to 60 Hz (ambient temperature inside the assembly: 55 °C, temperature of the conductor 70 °C) |
135 | Table N.2 – Factor k4 for different temperatures of the air inside the assembly and/or for the conductors |
136 | Annex O (informative) Guidance on temperature rise verification |
140 | Figure O.1 – Temperature rise verification methods |
141 | Annex P (normative) Verification of the short-circuit withstand strength of busbar structures by comparison with a tested reference design by calculation Figure P.1 – Tested busbar structure (TS) |
142 | Figure P.2 – Non tested busbar structure (NTS) |
144 | Figure P.3 – Angular busbar configuration with supports at the corners |
145 | Bibliography |