BS EN 61249-5-1:1996
$102.76
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings – Copper foils (for the manufacture of copper-clad base materials)
| Published By | Publication Date | Number of Pages |
| BSI | 1996 | 18 |
| Status | Definitive |
|---|---|
| Pages | 18 |
| Publication Date | 1996-09-15 |
| ISBN | 0 580 26167 0 |
| Standard Number | BS EN 61249-5-1:1996, IEC 61249-5-1:1995 |
| Title | Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings – Copper foils (for the manufacture of copper-clad base materials) |
| Identical National Standard Of | EN 61249-5-1:1996, IEC 61249-5-1:1995 |
| Descriptors | Purity, Holes, Classification systems, Films (states of matter), Printed circuits, Thickness, Mass, Printed-circuit boards, Tensile strength, Electrical conductivity, Coatings, Packaging, Flexible materials, Printed-circuit bases, Laminates, Surface properties, Grades (quality), Designations, Dimensional tolerances, Copper, Marking, Foil, Electrical testing, Metal coatings, Elongation at fracture, Dimensions, Electrical resistivity, Surface treatment |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 31.180 - Printed circuits and boards |
