BS EN 61215-2:2017:2018 Edition
$198.66
Terrestrial photovoltaic (PV) modules. Design qualification and type approval – Test procedures
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 54 |
This International Standard series lays down IEC requirements for the design qualification and type approval of terrestrial photovoltaic modules suitable for long-term operation in general open-air climates, as defined in IEC 60721‑2‑1 . This part of IEC 61215 is intended to apply to all terrestrial flat plate module materials such as crystalline silicon module types as well as thin-film modules.
This standard does not apply to modules used with concentrated sunlight although it may be utilized for low concentrator modules (1 to 3 suns). For low concentration modules, all tests are performed using the current, voltage and power levels expected at the design concentration.
The objective of this test sequence is to determine the electrical and thermal characteristics of the module and to show, as far as possible within reasonable constraints of cost and time, that the module is capable of withstanding prolonged exposure in general open-air climates. The actual lifetime expectancy of modules so qualified will depend on their design, their environment and the conditions under which they are operated.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 7 | English CONTENTS |
| 10 | FOREWORD |
| 12 | INTRODUCTION |
| 13 | 1 Scope and object 2 Normative references |
| 14 | 3 Terms and definitions |
| 15 | 4 Test procedures 4.1 Visual inspection (MQT 01) 4.1.1 Purpose 4.1.2 Procedure |
| 16 | 4.1.3 Requirements 4.2 Maximum power determination (MQT 02) 4.2.1 Purpose 4.2.2 Apparatus 4.2.3 Procedure 4.3 Insulation test (MQT 03) 4.3.1 Purpose |
| 17 | 4.3.2 Apparatus 4.3.3 Test conditions 4.3.4 Procedure 4.3.5 Test requirements 4.4 Measurement of temperature coefficients (MQT 04) |
| 18 | 4.5 Measurement of nominal module operating temperature (NMOT) (MQT 05) 4.5.1 General 4.5.2 Principle 4.5.3 Test procedure |
| 19 | 4.6 Performance at STC and NMOT (MQT 06) 4.6.1 Purpose 4.6.2 Apparatus 4.6.3 Procedure |
| 20 | 4.7 Performance at low irradiance (MQT 07) 4.7.1 Purpose 4.7.2 Apparatus 4.7.3 Procedure 4.8 Outdoor exposure test (MQT 08) 4.8.1 Purpose 4.8.2 Apparatus |
| 21 | 4.8.3 Procedure 4.8.4 Final measurements 4.8.5 Requirements 4.9 Hot-spot endurance test (MQT 09) 4.9.1 Purpose 4.9.2 Hot-spot effect |
| 22 | 4.9.3 Classification of cell interconnection Figures Figure 1 – Case S, series connection with optional bypass diode |
| 23 | Figure 2 – Case PS, parallel-series connection with optional bypass diode Figure 3 – Case SP, series-parallel connection with optional bypass diode |
| 24 | 4.9.4 Apparatus 4.9.5 Procedure |
| 25 | Figure 4 – Module I-V characteristics with different cells totally shadowed |
| 26 | Figure 5 – Module I-V characteristics with the test cell shadowed at different levels |
| 27 | Figure 6 – Hot-spot effect in a MLI thin-film module with serially connected cells |
| 29 | Figure 7 – Module I-V characteristics with different cells totally shadowed where the module design includes bypass diodes |
| 30 | Figure 8 – Module I-V characteristics with the test cell shadowed at different levels where the module design includes bypass diodes |
| 32 | 4.9.6 Final measurements 4.9.7 Requirements 4.10 UV preconditioning test (MQT 10) 4.10.1 Purpose 4.10.2 Apparatus |
| 33 | 4.10.3 Procedure 4.10.4 Final measurements 4.10.5 Requirements 4.11 Thermal cycling test (MQT 11) 4.11.1 Purpose 4.11.2 Apparatus |
| 34 | 4.11.3 Procedure 4.11.4 Final measurements Figure 9 – Thermal cycling test – Temperature and applied current profile |
| 35 | 4.11.5 Requirements 4.12 Humidity-freeze test (MQT 12) 4.12.1 Purpose 4.12.2 Apparatus 4.12.3 Procedure 4.12.4 Final measurements 4.12.5 Requirements |
| 36 | 4.13 Damp heat test (MQT 13) 4.13.1 Purpose 4.13.2 Procedure 4.13.3 Final measurements 4.13.4 Requirements Figure 10 – Humidity-freeze cycle – Temperature and humidity profile |
| 37 | 4.14 Robustness of terminations (MQT 14) 4.14.1 Purpose 4.14.2 Retention of junction box on mounting surface (MQT 14.1) 4.14.3 Test of cord anchorage (MQT 14.2) |
| 38 | Tables Table 1 – Pull forces for cord anchorage test |
| 39 | Table 2 – Values for torsion test |
| 40 | Figure 11 – a) Typical arrangement for the cord anchorage pull test for component testing from IEC 62790. b) Typical schematic arrangement for cord anchorage pull test on PV module mounted junction box |
| 41 | Figure 12 – Typical arrangement for torsion test |
| 42 | 4.15 Wet leakage current test (MQT 15) 4.15.1 Purpose 4.15.2 Apparatus 4.15.3 Procedure |
| 43 | 4.15.4 Requirements 4.16 Static mechanical load test (MQT 16) 4.16.1 Purpose 4.16.2 Apparatus |
| 44 | 4.16.3 Procedure 4.16.4 Final measurements 4.16.5 Requirements 4.17 Hail test (MQT 17) 4.17.1 Purpose 4.17.2 Apparatus |
| 45 | 4.17.3 Procedure Figure 13 – Hail-test equipment Table 3 – Ice-ball masses and test velocities |
| 46 | 4.17.4 Final measurements 4.17.5 Requirements Table 4 – Impact locations |
| 47 | 4.18 Bypass diode testing (MQT 18) 4.18.1 Bypass diode thermal test (MQT 18.1) Figure 14 – Hail test impact locations: top for wafer/cell based technologies, bottom for monolithic processed thin film technologies |
| 48 | Figure 15 – Bypass diode thermal test |
| 49 | 4.18.2 Bypass diode functionality test (MQT 18.2) |
| 50 | 4.19 Stabilization (MQT 19) 4.19.1 General 4.19.2 Criterion definition for stabilization 4.19.3 Light induced stabilization procedures |
| 51 | 4.19.4 Other stabilization procedures |
| 52 | 4.19.5 Initial stabilization (MQT 19.1) 4.19.6 Final stabilization (MQT 19.2) |
