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BS EN 61191-3:2017

BS EN 61191-3:2017

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Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies

Published By Publication Date Number of Pages
BSI 2017 26
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This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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BS EN 61191-3:2017
$142.49