BS EN 61189-3-719:2016
$102.76
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Published By | Publication Date | Number of Pages |
BSI | 2016 | 18 |
This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.