IEC 62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with \/2 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | National foreword <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 3.2 Abbreviated terms 4 Principles of deterioration 4.1 General 4.2 Solderability and oxidisation of lead finishes 4.3 Popcorning 4.4 Delamination 4.5 Corrosion and tarnishing <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4.6 Electrical effects 4.7 High-energy ionizing radiation damage 4.8 Storage temperature risks to semiconductor devices 4.9 Noble metal finishes 4.10 Matte tin and other finishes 4.11 Solder ball and solder bump <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.12 Devices containing programmable memory \u2013 flash, programmable logic and other devices containing non-volatile memory cells 5 Technical validation of the components 5.1 Purpose 5.2 Test selection criteria <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 5.3 Measurements and tests 5.3.1 Assessment of the supplied batch reliability 5.3.2 List of test methods Table 1 \u2013 List of tests <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 5.4 Periodic assessment <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Annex A (normative) Failure mechanisms \u2013 Encapsulated and non-encapsulated active components Table A.1 \u2013 Failure mechanisms: encapsulated and non-encapsulated active components <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Electronic components. Long-term storage of electronic semiconductor devices – Deterioration mechanisms<\/b><\/p>\n |