IEC TR 62866:2014
$74.75
Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing
Published By | Publication Date | Number of Pages |
IEC | 2014-05-07 | 192 |
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IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Published Code | IEC |
---|---|
Published By | International Electrotechnical Commission |
Publication Date | 2014-05-07 |
Pages Count | 192 |
Language | France |
Edition | 1.0 |
File Size | 4.3 MB |
ICS Codes | 31.180 - Printed circuits and boards |
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