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IEC TR 62866:2014

$74.75

Electrochemical migration in printed wiring boards and assemblies – Mechanisms and testing

Published By Publication Date Number of Pages
IEC 2014-05-07 192
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IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

IEC TR 62866:2014
$74.75