BS IEC 62615:2010:2011 Edition
$142.49
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 24 |
IEC 62615:2010 defines a method for pulse testing to evaluate the voltage current response of the component under test and to consider protection design parameters for electro-static discharge (ESD) human body model (HBM). This technique is known as transmission line pulse (TLP) testing. This document establishes a methodology for both testing and reporting information associated with transmission line pulse (TLP) testing. The scope and focus of this document pertains to TLP testing techniques of semiconductor components. This document should not become alternative method of HBM test standard such as IEC 60749-26. The purpose of the document is to establish guidelines of TLP methods that allow the extraction of HBM ESD parameters on semiconductor devices. This document provides the standard measurement and procedure for the correct extraction of HBM ESD parameters by using TLP.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | English FOREWORD |
| 6 | INTRODUCTION |
| 7 | 1 Scope and object 2 Normative references 3 Terms and definitions |
| 8 | 4 Test apparatus 4.1 General |
| 9 | 4.2 Oscilloscope 4.3 Voltage probe 4.4 Current probe 4.5 Transmission line 4.6 High voltage power supply 4.7 High voltage switch 4.8 Attenuator 4.9 Rise time filter |
| 10 | 5 TLP waveform parameters 5.1 Pulse characteristics 5.2 Pulse plateau 5.3 Pulse width Table 1 – TLP current and voltage pulse parameters |
| 11 | 5.4 Rise time 5.5 Fall time 5.6 Maximum peak current overshoot Figures Figure 1 – TLP waveform parameter illustration for pulse width rise time and fall time (parameters apply to both voltage and current TLP waveforms) Figure 2 – Illustration of maximum peak current overshoot |
| 12 | 5.7 Maximum current ringing duration 5.8 Maximum peak voltage overshoot 5.9 Maximum voltage ringing duration 5.10 Measurement window 6 Test requirements and procedures 6.1 Error correction 6.2 Tester error correction methodology Figure 3 – Illustration of maximum peak voltage overshoot |
| 13 | 6.3 Tester verification methodology |
| 14 | 6.4 TLP test procedure |
| 15 | Figure 4 – Flow diagram for the TLP component test procedure Figure 5 – Illustration of TLP pulse sequence |
| 16 | 7 Failure criteria 7.1 General information on failure criteria 7.2 Leakage current measurement 7.3 Leakage test voltage 7.4 Documentation |
| 17 | Annex A (informative) TLP design guidelines |
| 18 | Figure A.1 – Current source TLP method Table A.1 – TLP methodologies and parameters |
| 19 | Figure A.2 – Time domain reflectometer (TDR) TLP Figure A.3 – Time domain reflectometer (TDR) TLP (with balun and wafer probe) |
| 20 | Figure A.4 – Time domain transmission (TDT) TLP Figure A.5 – Time domain reflection and transmission |
