BS EN IEC 61190-1-3:2018 – TC:2020 Edition

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Tracked Changes. Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Published By	Publication Date	Number of Pages
BSI	2020	111

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IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for ‘special’ electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

Status	Definitive
Pages	111
Publication Date	2020-02-27
ISBN	978 0 539 11142 2
Standard Number	BS EN IEC 61190-1-3:2018 – TC
Title	Tracked Changes. Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Descriptors	Electrical connections, Solders, Pastes, Test methods, Quality assurance, Bonding, Particulate materials, Fluxes (materials), Soldering, Classification systems, Bars (materials), Quality control, Electronic engineering, Electronic equipment and components
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies


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