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BS EN 62435-2:2017

$142.49

Electronic components. Long-term storage of electronic semiconductor devices – Deterioration mechanisms

Published By Publication Date Number of Pages
BSI 2017 26
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IEC 62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with /2 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.

PDF Catalog

PDF Pages PDF Title
2 National foreword
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
8 FOREWORD
10 INTRODUCTION
12 1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
13 3.2 Abbreviated terms
4 Principles of deterioration
4.1 General
4.2 Solderability and oxidisation of lead finishes
4.3 Popcorning
4.4 Delamination
4.5 Corrosion and tarnishing
14 4.6 Electrical effects
4.7 High-energy ionizing radiation damage
4.8 Storage temperature risks to semiconductor devices
4.9 Noble metal finishes
4.10 Matte tin and other finishes
4.11 Solder ball and solder bump
15 4.12 Devices containing programmable memory – flash, programmable logic and other devices containing non-volatile memory cells
5 Technical validation of the components
5.1 Purpose
5.2 Test selection criteria
16 5.3 Measurements and tests
5.3.1 Assessment of the supplied batch reliability
5.3.2 List of test methods
Table 1 – List of tests
17 5.4 Periodic assessment
19 Annex A (normative) Failure mechanisms – Encapsulated and non-encapsulated active components
Table A.1 – Failure mechanisms: encapsulated and non-encapsulated active components
22 Bibliography
BS EN 62435-2:2017
$142.49